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To investigate the degradation of lead free solder heat‐sink attachment by thermal shock. Samples with high voiding percentages were selected for the investigation in order to get information on the significance of voids on the reliability of Sn‐Ag‐Cu heat‐sink attachment.

Through the use of X‐ray, C‐mode scanning acoustic microscopy, dye penetration, cross section and scanning electron microscopy/energy‐dispersive X‐ray tests, the degradation of Sn‐Ag‐Cu heat‐sink attachment during thermal shock cycling was evaluated.

The results showed that the Sn‐Ag‐Cu heat‐sink attachment where the area of voiding was 33‐48 per cent survived 3,000 thermal shock cycles, although degraded. The main degradation mechanism for the solder attachment was not solder fatigue but interface delamination due to Kirkendall voids at the Cu/Cu₃Sn interface. It was found that the large voids in the Sn‐Ag‐Cu heat‐sink attachment were not significantly affecting the solder joint lifetime. Big differences of intermetallic compound growth behaviour and Kirkendall voids at device/solder and solder/Cu pad interfaces are found and the reasons for this are discussed.

This work has clarified the general perception that large voids affect the thermo‐mechanical lifetime of solder joint substantially and also provides further understanding of the Sn‐Ag‐Cu heat‐sink attachment degradation mechanism.

Flip chip solder joint reliability under thermal shock stress was investigated both experimentally and by 2D finite element simulation. The results indicate that solder fatigue is the dominant failure mode and that delamination has obvious adverse effects on the solder joint lifetime. Different material/process combinations (underfill, flux, reflow atmospheres) were designed in order to understand the role of material/process factors on the solder joint lifetime and the results are discussed.

Products that have a short selling season face high uncertainty in demand. Retailers who sell such products therefore find the task of pricing and inventory challenging. Many retailers consider making these decisions as an art form and do not use quantitative models that are developed by researchers. Describes how retailers typically make pricing and inventory decisions and also reviews quantitative models that have been developed by researchers to improve on one or more of these decisions. A classification of these models is developed and how they can assist the retailer is explained. A simple explanation of two mathematical tools, Bayesian updating of information and dynamic programming, which are commonly mentioned in the literature are also given.

Flip chip on board (FCOB) solder joint reliability under thermal shock stress was investigated. With underfill materials, the solder joint lifetime was increased from 37 to 1,300/2,480 cycles depending on the particular underfill material used. Through the use of CSAM, SEM, dye penetration tests and cross sectioning, the reliability of a FCOB assembly under thermal shock stress was evaluated. Both dye penetration and SEM fracture analysis can be used to measure quantitatively the extent of crack propagation for assemblies without underfill. A new failure mechanism, PCB cracking was also observed and discussed.

In this chapter, we explore the impact of socioemotional and financial wealth on the resource management of family firms. We use MoDo, a Swedish pulp and paper firm, covering three generations of owner-managers from 1873 to 1991, to grasp the shifting emphases on socioemotional and financial wealth in the management of the company. Identifying four strategic issues of decisive importance for the development of MoDo, we analyze the organizational values that guided the management of these issues. We propose that financial and socioemotional wealth stand for two different rationalities that infuse organizational values. The MoDo case illustrates how these rationalities go hand in hand for extended periods of time, safeguarding both financial success and socioemotional endowments. However, in a situation where the rationalities are no longer in line with the development of the industry context, the conflict arising between the two rationalities may have fatal consequences for the firm in question.

Flip chip test boards with and without plasma enhanced chemical vapor deposition silicon nitride moisture barrier coatings were exposed to high humidity and temperature cycling conditions. The effect of the stress developed in these environments was investigated and evaluated. The influence of the barrier layers on the extent of underfill delamination and degradation in flip chip assemblies was inspected by C‐mode Scanning Acoustic Microscopy. The moisture barrier layers studied show their potential to enhance the reliability of flip chip assemblies in humid environments.

The newly emerging field of family violence has its modern origins in the early 1960s with the publication in 1962 of an article by C. Henry Kempe entitled “The Battered Child Syndrome.” This article captured the attention of professionals in medicine and the social sciences. Since that time there have been numerous articles and books dealing with the causes, treatment, and prevention of child abuse. Kempe has continued to work on child abuse and is Director of the National Center for the Prevention and Treatment of Child Abuse and Neglect in Denver. In editing books on helping the child and the family, he has collaborated with Ray E. Heifer, Professor in Pediatrics and Human Development at Michigan State University.

Social assistance and inactivity traps have long been considered as one of the main causes of the poor employment performance of EU countries. The success of New Labour in the UK has triggered a growing interests in instruments capable of combining the promotion of responsibility and self-sufficiency with solidarity with less skilled workers. Making-work-pay (MWP) policies, consisting of transfers to households with low earning capacity, have quickly emerged as the most politically acceptable instruments in tax-benefit reforms of many Anglo-Saxon countries. This chapter explores the impact of introducing the British Working Families’ Tax Credit (WFTC) in three EU countries with rather different labor market and welfare institutions: Finland, France and Germany. Simulating the reform reveals that, while first-round effects on income distribution is considerable, the interaction of the new instrument with the structural characteristics of the economy and the population may lead to counterproductive second round effects (i.e. changes in economic behavior). The implementation of the reform, in this case, could only be justified if the social inclusion (i.e. transition into activity) of some specific household types (singles and single mothers) is valued more than a rise in the employment per se.

Online social networks are increasingly important venues for businesses to promote their products and image. However, information propagation in online social networks is significantly more complicated compared to traditional transmission media such as newspaper, radio, and television. In this chapter, we will discuss research on modeling and forecasting diffusion of virally marketed content in social networks. Important aspects include the content and its presentation, the network topology, and transmission dynamics. Theoretical models, algorithms, and case studies of viral marketing will be explored.

Based on an extensive literature review, this chapter outlines key developments in global health and research during the last century with focus on the emergence of violence and child maltreatment as international public health priorities. Violence has been known to humans for millennia, but only in the late 1990s was it recognised as a global public health issue. Every year, an estimated 1 billion children are exposed to trauma, loss, abuse and neglect. Child maltreatment takes a social and economic toll on countries. Research initiated in 1985 found child maltreatment to be associated with increased disease, disability and premature death in adult survivors. The global availability of data on child maltreatment is, however, sporadic with low validity and reliability. Few global experts have consulted and involved the survivors of child maltreatment, as the experts by experience, in their attempts to provide a more comprehensive picture of reality. Youth and adult survivors of child maltreatment are often traumatised by the experience, and it is important to use trauma-informed approaches to prevent re-traumatisation. Participatory and inclusive research on child maltreatment is only in its infancy. There is a need for more inclusive research, designed by survivors for survivors, hereby strengthening local capacity building and informing policymakers from the bottom up. This chapter reviews lessons learnt and provides recommendations for how to enhance the participation and inclusion of the experts by experience in research on child maltreatment.